WebMay 29, 2024 · FOWLP (fan out wafer level packaging) is one of the fastest growing technology due to a smaller form factor, a lower package profile, increased I/O density, and low package cost. With the increasing demand of FOWLP technology, heterogeneous or multilayer FOWLP technology becomes the great subject of interest. However, many … WebMar 26, 2024 · FOWLP is a substrate-less structure. The advantages of substrate-less structures are the high electric performance, high thermal dissipation, and thin profile [ 9 ]. However, a thinner substrate-less structure causes higher warpage. Warpage is one of the weakness of a substrate-less structure.
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